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NISE 70-T06

Slim fanless PC, on-board Tiger Lake-UP3 i3-1115G4E with 4 x HDMI

  • Onboard Intel®  Core™ i3 1115G4E Tiger Lake-UP3 processor
  • 4 x HDMI
  • 3 x USB 3.0, 1 x USB 2.0
  • 1 x RS232/422/485, 1 x RS232
  • 3 x GbE LAN ports; support WoL, teaming and PXE
  • Onboard TPM 2.0 chip
  • 1 x M.2 socket for storage/4G LTE/5G modules
  • 1 x mini-PCIe socket support optional mSATA/Wi-Fi/BT/4G LTE module
  • Support operating temperature from -10°C to 60°C
  • Support+12V to 24VDC input; support ATX power mode

Overview

Powered by the latest generation of Intel®  Core™ i3 1115G4E processor (formerly codenamed "Tiger Lake-UP3"), NISE 70 is fanlsess PC designed for industrial applications which demand low power consumption and abundant I/O interfaces but with limited installation space.
NISE 70 supports a wide range of operating temperature from -10°C to 60°C and wide range DC power input from 12V to 24V. NISE 70 is also the first system in the slim NISE 50 series to support 4 independent displays and DDR4 3200MHz memory up to 32GB. The NISE 70 have strong connectivity - Ethernetbased LAN port and traditional serial port, mainly for Modbus TCP or Modbus RTU communication. For wireless connectivity, there are 1 x mini-PCIe socket and 1 x M.2 socket which can support optional wireless modules for IoT applications, for example, Wi-Fi, Bluetooth, 4G LTE, 5G modules as well as storage module. NISE 70 is definitely the best choice for M2M intelligent system as an intelligent IoT gateway

Specifications

CPU Support
  • Onboard Intel®  Core™ i3 1115G4E (15W TDP limited)
Main Memory
  • 1 x DDR4 3200 SO-DIMM socket, support up to 32GB
Display Option
  • 4 x HDMI ports, support 4K@30Hz
I/O Interface-Front
  • ATX power on/off switch
  • 4 x HDMI port, support 4K@30Hz
  • 2 x Intel®  I211 and 1 x Intel®  WGI219LM GbE LAN ports; support WoL, teaming and PXE
  • 1 x Antenna hole
I/O interface - Rear
  • 3 x USB 3.0 ports (900mA per each)
  • 1 x USB 2.0 (500mA per each)
  • 2 x DB9 for COM1 & COM2
    - COM1: RS232/422/485 auto flow control
    - COM2: full RS232 signal
  • 1 x 2-pin remote power on/off switch
  • 2 x Antenna hole
  • Support+12V to 24V DC input
I/O Interface – Internal
  • 4 x GPI and 4 x GPO (programmable to GPI or GPO)
Expansion Slot
  • 1 x mini-PCIe socket for optional Wi-Fi/BT/4G LTE/mSATA
  • 1 x M.2, support Key B & B+M module for optional 4G LTE/5G/SATA storage (SATA/PCIe/USB, 2242/3042)
Power Requirements
  • Power input: +12 to +24V DC
  • 1 x Optional 24V, 60W power adapter
Support OS
  • Windows®  10 Enterprise 64-bit
  • Linux Kernel 4.19
Dimensions
  • 198.8mm (W) x 150.4mm (D) x 37.7mm (H) with wall mount bracket
Construction
  • Aluminum and metal chassis with fanless design
Environment
  • Operating temperature: Ambient with air flow: -10°C to 60°C (according to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14)
  • Storage temperature: -20°C to 80°C
  • Relative humidity: 10% to 95% (non-condensing)
  • Shock protection:
    - M.2/mSATA: 50G, half sine, 11ms, IEC60068-2-27
  • Vibration protection with mSATA & M.2 condition:
    - Random: 2Grms@5~500 Hz, IEC60068-2-64
    - Sinusoidal: 2Grms@5~500 Hz, IEC60068-2-6
Certifications
  • CE
  • FCC Class A

Ordering Information

  • NISE 70-T06 (P/N: 10J00007005X0)
    Intel®  Core™ i3 1115G4E (Tiger Lake-UP3) processor fanless system (15W TDP limited)

  • 24V, 60W AC /DC power adapter w/o power cord
    (P/N: 7400060054X00)

Download

Upload Date File Name Version OS Type Description 文件下载
2021/08/04 NISE70 Quick Guide 1.0 All OS PDF 399.9 kB
Upload Date File Name Version OS Type Description 文件下载
2021/12/27 NISE70-T01/T02/T03 User Manual 1.0 All OS PDF 6.1 MB
Upload Date File Name Version OS Type Description 文件下载
2022/11/22 IGFX Windows 418.1 MB
2022/06/02 Chipset Windows 3.4 MB
2022/06/02 CSME Windows 674.6 MB
2022/06/02 Network Windows 121.6 MB
2022/06/02 Graphics Windows 425 MB
2022/06/02 SIO Windows 3.7 MB